SMD/BGA Rework System

Detail Specifications

The rework system consists of a ceramic pre-heater, an infra-red solderlight and a controller. The solderlight is designed especially for SMD/BGA rework and is also very convenient for re-balling smaller BGA components. When used in conjunction with the pre-heater, the system will achieve remarkable improvements in quality and efficiency of SMD/BGA rework operations. In normal operation, the pre-heater supplies 75% of the heating from below with the remaining 25% from above via the solderlight. Heating from both sides reduces the risk of damage to components and the circuit board due to uneven expansion when only one side is heated.
•Quartz heater for fast heat-up time
•Adjustable PCB support frame
•Push-button control of temperature
•Independant control of solderlight and pre-heat temperatures
•Stand with built-in cooling fan for solderlight
•No need for endless types of hot-air nozzles for each device style
•Supplied complete with footswitch control for solderlight, 5 various style tweezers and vacuum pick-up tool